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1 IPD033N06N rev.2.0,2016-09-12 final data sheet d-pak mosfet optimos tm power-transistor ,60v features ?optimizedforsynchronousrectification ?100%avalanchetested ?superiorthermalresistance ?n-channel,normallevel ?qualifiedaccordingtojedec 1) fortargetapplications ?pb-freeleadplating;rohscompliant ?halogen-freeaccordingtoiec61249-2-21 table1keyperformanceparameters parameter value unit v ds 60 v r ds(on),max 3.3 m w i d 90 a q oss 44 nc q g (0v..10v) 38 nc type/orderingcode package marking relatedlinks IPD033N06N pg-to252-3 033n06n - 1) j-std20 and jesd22 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
2 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet tableofcontents description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 package outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
3 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet 1maximumratings at t a =25c,unlessotherwisespecified table2maximumratings values min. typ. max. parameter symbol unit note/testcondition continuous drain current i d - - - - - - 90 90 22 a v gs =10v, t c =25c v gs =10v, t c =100c v gs =10v, t a =25c, r thja =50k/w pulsed drain current 1) i d,pulse - - 360 a t c =25c avalanche energy, single pulse 2) e as - - 60 mj i d =90a, r gs =25 w gate source voltage v gs -20 - 20 v - power dissipation p tot - - - - 107 3.0 w t c =25c t a =25c, r thja =50k/w operating and storage temperature t j , t stg -55 - 175 c iec climatic category; din iec 68-1: 55/175/56 2thermalcharacteristics table3thermalcharacteristics values min. typ. max. parameter symbol unit note/testcondition thermal resistance, junction - case r thjc - 0.8 1.4 k/w - device on pcb, minimal footprint r thja - - 62 k/w - device on pcb, 6 cm2 cooling area 3) r thja - - 40 k/w - soldering temperature, wave and reflow soldering are allowed t sold - - 260 c reflow msl1 1) see diagram 3 for more detailed information 2) see diagram 13 for more detailed information 3) device on 40 mm x 40 mm x 1.5 mm epoxy pcb fr4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. pcb is vertical in still air. 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
4 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet 3electricalcharacteristics table4staticcharacteristics values min. typ. max. parameter symbol unit note/testcondition drain-source breakdown voltage v (br)dss 60 - - v v gs =0v, i d =1ma gate threshold voltage v gs(th) 2.1 2.8 3.3 v v ds = v gs , i d =50a zero gate voltage drain current i dss - - 0.5 10 1 100 a v ds =60v, v gs =0v, t j =25c v ds =60v, v gs =0v, t j =125c gate-source leakage current i gss - 10 100 na v gs =20v, v ds =0v drain-source on-state resistance r ds(on) - - 3.0 4.1 3.3 5.0 m w v gs =10v, i d =90a v gs =6v, i d =22.5a gate resistance 1) r g - 1.2 1.8 w - transconductance g fs 65 130 - s | v ds |>2| i d | r ds(on)max , i d =90a table5dynamiccharacteristics 1) values min. typ. max. parameter symbol unit note/testcondition input capacitance c iss - 2700 3400 pf v gs =0v, v ds =30v, f =1mhz output capacitance c oss - 670 840 pf v gs =0v, v ds =30v, f =1mhz reverse transfer capacitance c rss - 28 56 pf v gs =0v, v ds =30v, f =1mhz turn-on delay time t d(on) - 10 - ns v dd =30v, v gs =10v, i d =90a, r g,ext ,ext=1.6 w rise time t r - 5 - ns v dd =30v, v gs =10v, i d =90a, r g,ext ,ext=1.6 w turn-off delay time t d(off) - 20 - ns v dd =30v, v gs =10v, i d =90a, r g,ext ,ext=1.6 w fall time t f - 5 - ns v dd =30v, v gs =10v, i d =90a, r g,ext ,ext=1.6 w table6gatechargecharacteristics 2) values min. typ. max. parameter symbol unit note/testcondition gate to source charge q gs - 14 - nc v dd =30v, i d =90a, v gs =0to10v gate charge at threshold q g(th) - 8 - nc v dd =30v, i d =90a, v gs =0to10v gate to drain charge 1) q gd - 7 10 nc v dd =30v, i d =90a, v gs =0to10v switching charge q sw - 13 - nc v dd =30v, i d =90a, v gs =0to10v gate charge total 1) q g - 38 44 nc v dd =30v, i d =90a, v gs =0to10v gate plateau voltage v plateau - 5.0 - v v dd =30v, i d =90a, v gs =0to10v gate charge total, sync. fet q g(sync) - 33 - nc v ds =0.1v, v gs =0to10v output charge 1) q oss - 44 59 nc v dd =30v, v gs =0v 1) defined by design. not subject to production test 2) see 2 gate charge waveforms 2 for parameter definition 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
5 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet table7reversediode values min. typ. max. parameter symbol unit note/testcondition diode continuous forward current i s - - 89 a t c =25c diode pulse current i s,pulse - - 360 a t c =25c diode forward voltage v sd - 0.9 1.2 v v gs =0v, i f =45a, t j =25c reverse recovery time 1) t rr - 39 63 ns v r =30v, i f =89a,d i f /d t =100a/s reverse recovery charge q rr - 45 - nc v r =30v, i f =89a,d i f /d t =100a/s 1) defined by design. not subject to production test 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
6 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet 4electricalcharacteristicsdiagrams diagram1:powerdissipation t c [c] p tot [w] 0 25 50 75 100 125 150 175 200 0 20 40 60 80 100 120 p tot =f( t c ) diagram2:draincurrent t c [c] i d [a] 0 25 50 75 100 125 150 175 200 0 20 40 60 80 100 i d =f( t c ); v gs 3 10v diagram3:safeoperatingarea v ds [v] i d [a] 10 -1 10 0 10 1 10 2 10 -1 10 0 10 1 10 2 10 3 1 s 10 s 100 s 1 ms 10 ms dc i d =f( v ds ); t c =25c; d =0;parameter: t p diagram4:max.transientthermalimpedance t p [s] z thjc [k/w] 10 -6 10 -5 10 -4 10 -3 10 -2 10 -1 10 -3 10 -2 10 -1 10 0 10 1 0.5 0.2 0.1 0.05 0.02 0.01 single pulse z thjc =f( t p );parameter: d = t p / t 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
7 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet diagram5:typ.outputcharacteristics v ds [v] i d [a] 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 40 80 120 160 200 240 280 320 360 10v 7 v 6 v 5.5 v 5 v 4.5 v i d =f( v ds ); t j =25c;parameter: v gs diagram6:typ.drain-sourceonresistance i d [a] r ds(on) [m w ] 0 40 80 120 160 200 240 280 320 360 0 1 2 3 4 5 6 7 8 9 10 4.5 v 5 v 5.5 v 6 v 7 v 10 v r ds(on) =f( i d ); t j =25c;parameter: v gs diagram7:typ.transfercharacteristics v gs [v] i d [a] 0 2 4 6 8 0 40 80 120 160 200 240 280 320 360 175 c 25 c i d =f( v gs );| v ds |>2| i d | r ds(on)max ;parameter: t j diagram8:typ.forwardtransconductance i d [a] g fs [s] 0 20 40 60 80 100 0 25 50 75 100 125 150 g fs =f( i d ); t j =25c 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
8 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet diagram9:drain-sourceon-stateresistance t j [c] r ds(on) [m w ] -60 -20 20 60 100 140 180 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5 6.0 6.5 max typ r ds(on) =f( t j ); i d =90a; v gs =10v diagram10:typ.gatethresholdvoltage t j [c] v gs(th) [v] -60 -20 20 60 100 140 180 0 1 2 3 4 5 500 a 50 a v gs(th) =f( t j ); v gs = v ds diagram11:typ.capacitances v ds [v] c [pf] 0 20 40 60 10 1 10 2 10 3 10 4 ciss coss crss c =f( v ds ); v gs =0v; f =1mhz diagram12:forwardcharacteristicsofreversediode v sd [v] i f [a] 0.0 0.5 1.0 1.5 2.0 10 0 10 1 10 2 10 3 25 c 175 c 175c max 25c max i f =f( v sd );parameter: t j 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3
9 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet diagram13:avalanchecharacteristics t av [s] i av [a] 10 0 10 1 10 2 10 3 10 0 10 1 10 2 25 c 100 c 125 c i as =f( t av ); r gs =25 w ;parameter: t j(start) diagram14:typ.gatecharge q gate [nc] v gs [v] 0 10 20 30 40 0 1 2 3 4 5 6 7 8 9 10 12 v 30 v 48 v v gs =f( q gate ); i d =90apulsed;parameter: v dd diagram15:drain-sourcebreakdownvoltage t j [c] v br(dss) [v] -60 -20 20 60 100 140 180 54 56 58 60 62 64 66 v br(dss) =f( t j ); i d =1ma 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3 gate charge waveforms
10 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet 5packageoutlines figure1outlinepg-to252-3,dimensionsinmm/inches 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3 gate charge waveforms
11 optimos tm power-transistor ,60v IPD033N06N rev.2.0,2016-09-12 final data sheet revisionhistory IPD033N06N revision:2016-09-12,rev.2.0 previous revision revision date subjects (major changes since last revision) 2.0 2016-09-12 release of final version trademarksofinfineontechnologiesag aurix?,c166?,canpak?,cipos?,coolgan?,coolmos?,coolset?,coolsic?,corecontrol?,crossave?,dave?,di-pol?,drblade?, easypim?,econobridge?,econodual?,econopack?,econopim?,eicedriver?,eupec?,fcos?,hitfet?,hybridpack?,infineon?, isoface?,isopack?,i-wafer?,mipaq?,modstack?,my-d?,novalithic?,omnitune?,optiga?,optimos?,origa?,powercode?, primarion?,primepack?,primestack?,profet?,pro-sil?,rasic?,real3?,reversave?,satric?,sieget?,sipmos?,smartlewis?, solidflash?,spoc?,tempfet?,thinq?,trenchstop?,tricore?. trademarksupdatedaugust2015 othertrademarks allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners. welistentoyourcomments anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?yourfeedbackwillhelpustocontinuously improvethequalityofthisdocument.pleasesendyourproposal(includingareferencetothisdocument)to: erratum@infineon.com publishedby infineontechnologiesag 81726mnchen,germany ?2016infineontechnologiesag allrightsreserved. legaldisclaimer theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics (beschaffenheitsgarantie). withrespecttoanyexamples,hintsoranytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthe product,infineontechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty. inaddition,anyinformationgiveninthisdocumentissubjecttocustomerscompliancewithitsobligationsstatedinthis documentandanyapplicablelegalrequirements,normsandstandardsconcerningcustomersproductsandanyuseofthe productofinfineontechnologiesincustomersapplications. thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.itistheresponsibilityofcustomers technicaldepartmentstoevaluatethesuitabilityoftheproductfortheintendedapplicationandthecompletenessoftheproduct informationgiveninthisdocumentwithrespecttosuchapplication. information forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestinfineon technologiesoffice( www.infineon.com ). warnings duetotechnicalrequirements,componentsmaycontaindangeroussubstances.forinformationonthetypesinquestion, pleasecontactthenearestinfineontechnologiesoffice. theinfineontechnologiescomponentdescribedinthisdatasheetmaybeusedinlife-supportdevicesorsystemsand/or automotive,aviationandaerospaceapplicationsorsystemsonlywiththeexpresswrittenapprovalofinfineontechnologies,ifa failureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support,automotive,aviationand aerospacedeviceorsystemortoaffectthesafetyoreffectivenessofthatdeviceorsystem.lifesupportdevicesorsystemsare intendedtobeimplantedinthehumanbodyortosupportand/ormaintainandsustainand/orprotecthumanlife.iftheyfail,itis reasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered. 1 2 3 tab d r a i n p i n 2 , t a b g a t e p i n 1 s o u r c e p i n 3 gate charge waveforms

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